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1. general description the 74lvc2244a is an octal non-inverting buffer/line driver with 3-state outputs. the 3-state outputs are controlled by the output enable input pins 1oe and 2oe . a high on pin noe causes the outputs to assume a high -impedance off-state. schmitt trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times. the device is designed with 30 ? series termination resistors in both high and low output stages to reduce line noise. inputs can be driven from either 3.3 v or 5 v de vices. when disabled, up to 5.5 v can be applied to the outputs. these features allow the use of these device s as translators in mixed 3.3 v and 5 v applications. 2. features and benefits ? 5 v tolerant inputs/outputs, for interfacing with 5 v logic ? wide supply voltage range from 1.2 v to 3.6 v ? cmos low-power consumption ? direct interface with ttl levels ? integrated 30 ? termination resistors ? complies with jedec standard: ? jesd8-7a (1.65 v to 1.95 v) ? jesd8-5a (2.3 v to 2.7 v) ? jesd8-c/jesd36 (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115b exceeds 200 v ? cdm jesd22-c101e exceeds 1000 v ? specified from ? 40 ? c to +85 ? c and ? 40 ? c to +125 ? c 74lvc2244a octal buffer/line driver; 30 ? series termination; 5 v tolerant input/output; 3-state rev. 5 ? 3 november 2011 product data sheet
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 2 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74lvc2244ad ? 40 ? c to +125 ? c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74lvc2244adb ? 40 ? c to +125 ? c ssop20 plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 74lvc2244apw ? 40 ? c to +125 ? c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 74LVC2244ABQ ? 40 ? c to +125 ? c dhvqfn20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 ? 4.5 ? 0.85 mm sot764-1 fig 1. iec logic symbol fig 2. logic diagram 12 14 2 4 6 8 18 16 1 en mna169 3 5 11 13 15 17 9 7 19 en mna170 1a3 1a2 1a1 1a0 2 4 6 8 1 1y0 1y1 18 16 14 12 1y2 1y3 1oe 2a3 2a2 2a1 2a0 17 15 13 11 19 2y0 2y1 3 5 7 9 2y2 2y3 2oe
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 3 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 3. pin configuration so20 and (t)ssop20 fig 4. pin configuration dhvqfn20 74lvc2244a 001aad084 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 1oe 1a0 2y0 1a1 2y1 1a2 2y2 1a3 2y3 gnd v cc 2oe 1y0 2a0 2a1 1y2 1y1 2a2 1y3 2a3 001aad085 74lvc2244a transparent top view gnd (1) gnd 2a3 1oe v cc 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 10 11 1 20 terminal 1 index area 1a0 2y0 1a1 2y1 1a2 2y2 1a3 2y3 2oe 1y0 2a0 1y1 2a1 1y2 2a2 1y3 table 2. pin description symbol pin description 1oe 1 output enable input (active low) 2oe 19 output enable input (active low) 1a[0:3] 2, 4, 6, 8 data input 2a[0:3] 17, 15, 13, 11 data input 1y[0:3] 18, 16, 14, 12 data output 2y[0:3] 3, 5, 7, 9 data output gnd 10 ground (0 v) v cc 20 supply voltage
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 4 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 6. functional description [1] h = high voltage level l = low voltage level x = don?t care z = high-impedance off-state 7. limiting values [1] the minimum input voltage ratings may be excee ded if the input current ratings are observed. [2] the output voltage ratings may be exceeded if the output current ratings are observed. [3] for so20 packages: above 70 ? c derate linearly with 8 mw/k. for (t)ssop20 packages: above 60 ? c derate linearly with 5.5 mw/k. for dhvqfn20 packages: above 60 ? c derate linearly with 4.5 mw/k. table 3. functional table [1] input output noe nan nyn ll l lh h hx z table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +6.5 v i ik input clamping current v i < 0 v ? 50 - ma v i input voltage [1] ? 0.5 +6.5 v i ok output clamping current v o > v cc or v o < 0 v - ? 50 ma v o output voltage output high or low state [2] ? 0.5 v cc + 0.5 v output 3-state [2] ? 0.5 +6.5 v i o output current v o = 0 v to v cc - ? 50 ma i cc supply current - 100 ma i gnd ground current ? 100 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +125 ?c [3] -5 0 0m w
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 5 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 8. recommended operating conditions 9. static characteristics table 5. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.65 - 3.6 v functional 1.2 - - v v i input voltage 0 - 5.5 v v o output voltage output high or low state 0 - v cc v output 3-state 0 - 5.5 v t amb ambient temperature ? 40 - +125 ?c ? t/ ? v input transition rise and fall rate v cc = 1.65 v to 2.7 v 0 - 20 ns/v v cc = 2.7 v to 3.6 v 0 - 10 ns/v table 6. static characteristics at recommended operating conditions. volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max v ih high-level input voltage v cc = 1.2 v 1.08 - - 1.08 - v v cc = 1.65 v to 1.95 v 0.65 ? v cc - - 0.65 ? v cc -v v cc = 2.3 v to 2.7 v 1.7 - - 1.7 - v v cc = 2.7 v to 3.6 v 2.0 - - 2.0 - v v il low-level input voltage v cc = 1.2 v - - 0.12 - 0.12 v v cc = 1.65 v to 1.95 v - - 0.35 ? v cc -0.35 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 - 0.8 v v oh high-level output voltage v i =v ih or v il i o = ? 100 ? a; v cc =1.65vto3.6v v cc ? 0.2 v cc -v cc ? 0.3 - v i o = ? 2ma; v cc = 1.65 v 1.2 - - 1.05 - v i o = ? 4ma; v cc = 2.3 v 1.8 - - 1.65 - v i o = ? 6ma; v cc = 2.7 v 2.2 - - 2.05 - v i o = ? 9ma; v cc = 2.7 v 2.4 - - 2.25 - v i o = ? 12 ma; v cc = 3.0 v 2.2 - - 2.0 - v v ol low-level output voltage v i =v ih or v il i o = 100 ? a; v cc = 1.65 v to 3.6 v - - 0.2 - 0.3 v i o =2ma; v cc = 1.65 v - - 0.45 - 0.65 v i o =4ma; v cc = 2.3 v - - 0.6 - 0.8 v i o =6ma; v cc = 2.7 v - - 0.4 - 0.6 v i o =12ma; v cc = 3.0 v - - 0.55 - 0.8 v i i input leakage current v cc = 3.6 v; v i =5.5vorgnd - ? 0.1 ? 5- ? 20 ? a
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 6 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state [1] all typical values are measured at v cc = 3.3 v (unless stated otherwise) and t amb =25 ? c. i oz off-state output current v i =v ih or v il ; v cc = 3.6 v; v o =5.5vorgnd; - ? 0.1 ? 5- ? 20 ? a i off power-off leakage current v cc = 0 v; v i or v o = 5.5 v - ? 0.1 ? 10 - ? 20 ? a i cc supply current v cc = 3.6 v; v i =v cc or gnd; i o =0a -0.110 - 40 ? a ? i cc additional supply current per input pin; v cc = 2.7 v to 3.6 v; v i =v cc ? 0.6 v; i o =0a - 5 500 - 5000 ? a c i input capacitance v cc = 0 v to 3.6 v; v i =gndtov cc -4.0- - -pf table 6. static characteristics ?continued at recommended operating conditions. volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 7 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 10. dynamic characteristics [1] typical values are measured at t amb =25 ? c and v cc = 1.2 v, 1.8 v, 2.5 v, 2.7 v, and 3.3 v respectively. [2] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . [3] skew between any two outputs of the same package switching in the same direction. this parameter is guaranteed by design. [4] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz c l = output load capacitance in pf v cc = supply voltage in volts n = number of inputs switching ? (c l ? v cc 2 ? f o ) = sum of the outputs table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v). for test circuit see figure 7 . symbol parameter conditions t amb = ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max t pd propagation delay nan to nyn; see figure 5 [2] v cc = 1.2 v - 35 - - - ns v cc = 1.65 v to 1.95 v 1.9 7.8 17.7 1.9 18.6 ns v cc = 2.3 v to 2.7 v 1.5 4.1 8.7 1.5 9.6 ns v cc = 2.7 v 1.5 4.1 6.4 1.5 7.0 ns v cc = 3.0 v to 3.6 v 1.5 3.5 5.5 1.5 8.0 ns t en enable time noe to nyn; see figure 6 [2] v cc = 1.2 v - 38 - - - ns v cc = 1.65 v to 1.95 v 2.3 8.9 19.7 2.3 20.7 ns v cc = 2.3 v to 2.7 v 1.9 5.0 10.3 1.9 11.4 ns v cc = 2.7 v 1.5 5.1 8.1 1.5 9.0 ns v cc = 3.0 v to 3.6 v 1.0 4.0 7.1 1.0 10.5 ns t dis disable time noe to nyn; see figure 6 [2] v cc = 1.2 v - 9.0 - - - ns v cc = 1.65 v to 1.95 v 2.9 4.7 9.3 2.9 9.8 ns v cc = 2.3 v to 2.7 v 1.0 2.6 5.0 1.0 5.6 ns v cc = 2.7 v 1.5 3.4 6.4 1.5 7.0 ns v cc = 3.0 v to 3.6 v 1.5 3.2 5.4 1.5 8.0 ns t sk(o) output skew time v cc = 3.0 v to 3.6 v [3] - - 1.0 - 1.5 ns c pd power dissipation capacitance per input; v i =gndtov cc [4] v cc = 1.65 v to 1.95 v - 1.8 - - - pf v cc = 2.3 v to 2.7 v - 4.9 - - - pf v cc = 3.0 v to 3.6 v - 7.7 - - - pf
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 8 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 11. waveforms v m = 1.5 v at v cc ? 2.7 v. v m =0.5 ? v cc at v cc <2.7v. v ol and v oh are typical output voltage levels that occur with the output load. fig 5. the input (nan) to output (nyn) propagation delays mna171 nan input nyn output t plh t phl gnd v i v m v m v m v m v oh v ol v m = 1.5 v at v cc ? 2.7 v. v m =0.5 ? v cc at v cc <2.7v. v x = v ol + 0.3 v at v cc ? 2.7 v; v x = v ol + 0.15 v at v cc <2.7v. v y = v oh ? 0.3 v at v cc ? 2.7 v; v y = v oh ? 0.15 v at v cc < 2.7 v. v ol and v oh are typical output voltage levels that occur with the output load. fig 6. 3-state enable and disable times mna362 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 9 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state test data is given in table 8 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 7. test circuit for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aae331 v ext v cc v i v o dut c l r t r l r l g table 8. test data supply voltage input load v ext v i t r , t f c l r l t plh , t phl t plz , t pzl t phz , t pzh 1.2 v v cc ? 2 ns 30 pf 1 k ? open 2 ? v cc gnd 1.65 v to 1.95 v v cc ? 2 ns 30 pf 1 k ? open 2 ? v cc gnd 2.3 v to 2.7 v v cc ? 2 ns 30 pf 500 ? open 2 ? v cc gnd 2.7v 2.7v ? 2.5 ns 50 pf 500 ? open 2 ? v cc gnd 3.0vto3.6v 2.7v ? 2.5 ns 50 pf 500 ? open 2 ? v cc gnd
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 10 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 12. package outline fig 8. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z ywv references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 11 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state fig 9. package outline sot339-1 (ssop20) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p q (1) zywv references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 0.9 0.7 0.9 0.5 8 0 o o 0.13 1.25 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 sot339-1 mo-150 99-12-27 03-02-19 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 11 0 20 11 y 0.25 pin 1 index 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 a max. 2
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 12 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state fig 10. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 11 0 20 11 pin 1 index a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 13 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state fig 11. package outline sot764-1 (dhvqfn20) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.6 4.4 d h 3.15 2.85 y 1 2.6 2.4 1.15 0.85 e 1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot764-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot764-1 dhvqfn20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 29 19 12 11 10 1 20 x d e c b a terminal 1 index area ac c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 14 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 13. abbreviations 14. revision history table 9. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 10. revision history document id release date data sheet status change notice supersedes 74lvc2244a v.5 20111103 product data sheet - 74lvc2244a v.4 modifications: ? the format of this document has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? ta b l e 4 , table 5 , table 6 , ta b l e 7 and ta b l e 8 : values added for lower voltage ranges. 74lvc2244a v.4 20040407 product specification - 74lvc2244a v.3 74lvc2244a v.3 20021213 product specification - 74lvc2244a v.2 74lvc2244a v.2 20020618 product specification - 74lvc2244a v.1 74lvc2244a v.1 19990930 product specification - -
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 15 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74lvc2244a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 3 november 2011 16 of 17 nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74lvc2244a octal buffer/line driver; 30 ? series termination; 3-state ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 november 2011 document identifier: 74lvc2244a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 contact information. . . . . . . . . . . . . . . . . . . . . 16 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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